bg电子娱乐场

Feb 27, 2025  Chennai / India

Opening of new Application Engineering Center and manufacturing expansion

bg电子娱乐场 strengthens its electronics footprint in India 

bg电子娱乐场 today announced the launch of a state-of-the-art Application Engineering Center in Chennai, Tamil Nadu, further strengthening the leadership of its Adhesive Technologies business in the electronics sector. The company will also be setting up an adhesive materials manufacturing plant for the electronics sector at its multi-technology manufacturing site in Kurkumbh, near Pune. 

These investments underscore bg电子娱乐场鈥檚 commitment to localization, innovation, and accelerated product development to meet the rapidly evolving demands of the region鈥檚 electronics industry. As India's electronics industry is projected to grow exponentially in the next few years, bg电子娱乐场鈥檚 expanded footprint positions it to strongly support this rapid growth.

鈥淎s the country solidifies its position as a global electronics manufacturing hub, bg电子娱乐场 is proud to reinforce its 鈥楳ake in India鈥 commitment, and be a key partner in this journey,鈥 said S Sunil Kumar, Country President for India at bg电子娱乐场. 鈥淭hese new facilities in Chennai and Kurkumbh align with this growth, strengthening regional self-sufficiency and supply chain resilience. This marks an exciting milestone in our journey to better serve our global customer base while expanding our footprint in the region.  It demonstrates our commitment to fostering long-term partnerships, driving innovation, and creating value for our customers.鈥

Located in Tamil Nadu 鈥 a key hub for global electronics manufacturing 鈥 the Chennai facility is designed to accelerate new product introductions (NPIs) and reduce time-to-market for customers. The center houses five specialized labs dedicated to advanced adhesive solutions and thermal management materials, essential for enhancing the reliability, durability, and sleek designs of smartphones, wearables, and other consumer electronics. Equipped with state-of-the-art dispensing systems, vacuum impregnation technologies for device waterproofing, and high-precision material analysis tools, the center enables rapid prototyping, proof-of-concept testing, and product validation. This center will enhance bg电子娱乐场鈥檚 global innovation footprint, complementing its existing sites in Germany, the US, China, Singapore, Japan, Korea and Vietnam. With these investments, bg电子娱乐场 further strengthens its role as a key innovation partner for electronics manufacturers worldwide.

Wen Zhou, Corporate Vice President Electronics at bg电子娱乐场 Adhesive Technologies, shared that these investments are a natural progression of the company鈥檚 growth in India and the electronic market鈥檚 supply chain diversification. 鈥淲e meet our customers where they are,鈥 said Wen. 鈥淲e have had established Indian operations for a long time, and with customers intensifying their operations in the region, we are investing in additional local capabilities to deliver collaborative NPI and product validation expertise with more immediacy.鈥 

The new plant in Kurkumbh will enhance bg电子娱乐场鈥檚 capabilities in high-performance adhesive and coating solutions, reinforcing its commitment to localization and meeting the evolving demands of India鈥檚 electronics sector. The plant will benefit from the industry 4.0 based smart factory system deployed at the Kurkumbh manufacturing site, which enhances operational efficiency and product quality while minimizing downtime.

bg电子娱乐场 has inaugurated its new Application Engineering Center for the electronics sector in Chennai, India. From left to right: Kevin Becker, Vice President Innovation for Electronics; Wen Zhou, Corporate Vice President for Electronics; S Sunil Kumar, Country President bg电子娱乐场 India; Timothy McKenney, Director, Strategy & PMO for Electronics and Jason Cheung, Head of Sales Consumer Device India and China

Sebastian Hinz Adhesive Technologies Media Relations Headquarters, D眉sseldorf/Germany +49-211-797-8594 press@henkel.com Download Business Card Add to my collection